Ampla aplicação de nitreto de boro hexagonal - material de resfriamento de cavacos

À medida que os componentes e sistemas eletrônicos se tornam menores e mais rápidos, o tratamento térmico e a confiabilidade tornam-se questões-chave que afetam sua longevidade. O gerenciamento térmico do ponto quente local com alto fluxo de calor é a chave dos dispositivos eletrônicos de alta potência.

Although graphene has a very high thermal conductivity (5300W/(m·K)), it was found in the experiment that the thickness of the silicon dioxide insulation layer on the chip surface would affect the heat dissipation effect of graphene. If the silicon dioxide layer is too thick, it will hinder the effective conduction of hot spot heat to the graphene layer; if the silicon dioxide layer is too thin, it is easy to make the metal circuit contact with the graphene layer and cause short circuit. Hexagonal boron nitride, as a material of both insulation and high thermal conductivity, will become the key material to improve the heat dissipation capacity of chips.